| 1. | If you have created a modules package , you ll need to install that package as well
如果您创建了一个模块软件包，也要同时安装该软件包。 |
| 2. | If you have created a modules package , e . g . , if you have pcmcia , you ll need to install that package as well
如果您创建了一个模块软件包，例如pcmcia ，您也必须同时安装该软件包。 |
| 3. | During this process , waspostupgrade also creates web modules packaged in war files and ejb modules packaged in jar files
在这个过程中， waspostupgrade也创建被打包在war文件中的web模块和被打包在jar文件中的ejb模块。 |
| 4. | Results in the paper will supply references to thermal designs of multi - chip module packaging based on diamond material
本文对金刚石材料在多芯片组件热性能改善和热应力研究,对金刚石在多芯片组件封装热设计应用具有一定的参考价值和提供一定的理论依据。 |
| 5. | In this paper outlining the characteristics of diamond substrate and problems to be faced with , and measures to be taken , introducing knowledge of multi - chips modules packaging
本文首先综述了热沉用金刚石基板的特点和面临的问题及相应的措施;并介绍了多芯片组件封装技术相关知识。 |
| 6. | Based on the different requirements on the operating mode , the back surface cooling package style by impinge cooler and the module package style by micro - channels coolers were studied respectively
根据对二极管激光器不同工作模式要求，分别研究了采用冲击式冷却器的背冷式二维阵列封装和微通道冷却的模块化封装。 |
| 7. | Either your clients must download the sdk ( including the extra 30 mb of developer code and documentation ) or you must prepare a runtime module package yourself as a separate download from your application
你的客户必须下载sdk （包括额外的30mb开发者编码和文件） ，或者你必须自己准备一个运行时间模型，作为你的应用软件的一个单独的下载文件。 |
| 8. | Being based on actual multi - chips module packaging structure a three dimensional thermal analysis model is built , thermal analysis on multi - chips module is conducted using diamond substrate and thermal interfacial materials ; a two dimensional and three dimensional chip - adhesive ? substrate thermal stress model are built , and interfacial thermal stress distributions are computed based on different area ratios and thickness ratios of substrate to chip
本文根据实际的多芯片组件的封装结构,建立了三维温度场分析模型,分析了金刚石作为导热层和基板对多芯片组件散热性能的改善;建立了二维和三维的芯片-粘结层-基板热力学模型,分析了不同的基板/芯片厚度比和面积比对层间热应力分布的影响。 |
